TE Connectivity 25114x Contact Pads
TE Connectivity's 25114x Contact Pads are designed for repeated mating purposes on the PCB. These contacts can be a charging pad mated with a Pogo pin/spring finger for a wide range of PCB applications across all industries. The 25114x contact pads are available in various diameters (1.5mm to 2.99mm) and heights (0.8mm to 1.91mm) to meet different needs. These contacts offer reliable and durable mating performance compared to copper foil on PCBs. The 25114x contact pads are applicable for wearable devices, POS scanners, security systems, GPS devices, tablets, game consoles, and testing equipment.
Features
- Board-to-component connector system
- Connector and contact terminate on the printed circuit board
- Gold PCB contact termination area plating material and point of contact area plating material
- Brass alloy contact base material
- Nickel contact underplating material
- 1.5mm to 2.99mm diameter and 0.8mm to 1.91mm thickness
Applications
- IoT
- Mobile phones
- Wearable devices
- Game consoles
- Tablets
- Patient monitoring devices
- POS scanners
- Security systems
- GPS devices
View Results ( 6 ) Page
| Nº de ref. | Diâmetro interno | Descrição |
|---|---|---|
| 2511417-1 | 1.98 mm | Placa de circuito impresso CONTACT PAD, 1.98Dx0.64H, GOLD |
| 2511417-2 | 1.98 mm | Placa de circuito impresso CONTACT PAD, 1.98Dx1.14H, GOLD |
| 2511417-3 | 1.98 mm | Placa de circuito impresso CONTACT PAD, 1.98Dx1.40H, GOLD |
| 2511418-1 | 2.99 mm | Placa de circuito impresso CONTACT PAD, 2.99Dx1.40H, GOLD |
| 2511418-2 | 2.99 mm | Placa de circuito impresso CONTACT PAD, 2.99Dx1.91H, GOLD |
| 2511420-1 | 1.5 mm | Placa de circuito impresso CONTACT PAD, 1.50Dx0.80H, GOLD |
Publicado: 2025-12-03
| Atualizado: 2025-12-17