25114x Contact Pads

TE Connectivity's 25114x Contact Pads are designed for repeated mating purposes on the PCB. These contacts can be a charging pad mated with a Pogo pin/spring finger for a wide range of PCB applications across all industries. The 25114x contact pads are available in various diameters (1.5mm to 2.99mm) and heights (0.8mm to 1.91mm) to meet different needs. These contacts offer reliable and durable mating performance compared to copper foil on PCBs. The 25114x contact pads are applicable for wearable devices, POS scanners, security systems, GPS devices, tablets, game consoles, and testing equipment.

Resultados: 6
Selecionar Imagem Número de peça Fabricante Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade. Qtde RoHS Modelo ECAD Produto Tipo Diâmetro interno
TE Connectivity Placa de circuito impresso CONTACT PAD, 1.98Dx0.64H, GOLD 4,900Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Contact Pad 1.98 mm
TE Connectivity Placa de circuito impresso CONTACT PAD, 1.98Dx1.14H, GOLD 4,995Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Contact Pad 1.98 mm
TE Connectivity Placa de circuito impresso CONTACT PAD, 1.98Dx1.40H, GOLD 5,000Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Contact Pad 1.98 mm
TE Connectivity Placa de circuito impresso CONTACT PAD, 2.99Dx1.40H, GOLD 5,000Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Contact Pad 2.99 mm
TE Connectivity Placa de circuito impresso CONTACT PAD, 2.99Dx1.91H, GOLD 5,000Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Contact Pad 2.99 mm
TE Connectivity Placa de circuito impresso CONTACT PAD, 1.50Dx0.80H, GOLD 4,970Em estoque
Mín.: 1
Mult.: 1
Bobina: 2,500

Spring Contact 1.5 mm