Módulos multiprotocolo

Resultados: 1,524
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Tensão de alimentação - Máx
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Protocolo - Bluetooth, BLE - 802.15.1
Protocolo - celular, NBIoT, LTE
Protocolo - GPS, GLONASS
Protocolo - Sub GHz
Protocolo - WiFi - 802.11
Protocolo - ANT, Thread, Zigbee - 802.15.4
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Embalagem
Murata Electronics Módulos multiprotocolo Type 1XL Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Ficha técnica
1,830Em estoque
Mín.: 1
Mult.: 1
Bobina: 1,000

1XL 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UART 1.71 V 3.46 V - 40 C + 60 C Without Antenna 19.1 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Intel AX210.NGWGIE.NV99ARN4
Intel Módulos multiprotocolo Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 152Em estoque
Mín.: 1
Mult.: 1

Intel AX211.NGWG.NV
Intel Módulos multiprotocolo Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro
Ficha técnica
426Em estoque
Mín.: 1
Mult.: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Ezurio Módulos multiprotocolo BLE v4.2 Module NFC Integrated Ant. (Nordic nRF52832)
Ficha técnica
906Em estoque
Mín.: 1
Mult.: 1

BL65x 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C Chip 14 mm x 10 mm x 2.1 mm Bluetooth LE NFC Cut Tape
Insight SiP Módulos multiprotocolo nRF52832 LoRa Transceiver & BLE 5 Module AS
Ficha técnica
69Em estoque
Mín.: 1
Mult.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
6Em estoque
Mín.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
6Em estoque
Mín.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel Módulos multiprotocolo Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Ficha técnica
28Em estoque
Mín.: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
M5Stack Módulos multiprotocolo a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash
Ficha técnica
10Em estoque
Mín.: 1
Mult.: 1

I2C 25.93 mm x 18 mm x 4.7 mm
CEL Módulos multiprotocolo CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Ficha técnica
2Em estoque
Mín.: 1
Mult.: 1

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology Módulos multiprotocolo [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Ficha técnica
10Em estoque
Mín.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Silex Technology Módulos multiprotocolo [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Ficha técnica
15Em estoque
Mín.: 1
Mult.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
u-blox Módulos multiprotocolo 88W8887, 802.11ac+BT, 1 antenna pin
Ficha técnica
278Em estoque
Mín.: 1
Mult.: 1
Bobina: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C External 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel, Cut Tape
Pulse Electronics Módulos multiprotocolo USB 802.11 b/g/n BT module 746Em estoque
Mín.: 1
Mult.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
HMS Networks Módulos multiprotocolo Wireless Bolt-CAN Interface
Ficha técnica
2Em estoque
Mín.: 1
Mult.: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Intel Módulos multiprotocolo Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Ficha técnica
490Em estoque
Mín.: 1
Mult.: 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax
Silex Technology Módulos multiprotocolo [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Ficha técnica
253Em estoque
97Esperado 29/04/2026
Mín.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Módulos multiprotocolo [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
Ficha técnica
161Em estoque
Mín.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Ezurio Módulos multiprotocolo RF Module, Sterling LWB+, Chip Antenna, CutTape CYW43439
Ficha técnica
154Em estoque
1,000Esperado 11/08/2026
Mín.: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Silicon Labs Módulos multiprotocolo Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Ficha técnica
99Em estoque
Mín.: 1
Mult.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Seeed Studio Módulos multiprotocolo The factory is currently not accepting orders for this product. 188Em estoque
Mín.: 1
Mult.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Ezurio Módulos multiprotocolo RF Module, Sterling LWB+, MHF4, Cut Tape CYW43439
Ficha técnica
75Em estoque
Mín.: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Lantronix Módulos multiprotocolo BOLERO43 - EMEA - LTE CAT-M1 band 20, 8, 3, 7- 2G FB band 8, 3 - IP 67 GNSS - LI ON BATTERY BACKUP - RS232 - 10 WIRE AS FOLLOW - 2 WIRES - 2 I/O - 1 WIRE INTERFACE - CAN BUS SUPPORT - AVL SOFTWARE.
Ficha técnica

BOLERO RS-232 10.8 V 48 V LTE Cat-M1 GNSS Bulk
Intel Módulos multiprotocolo Intel Wi-Fi 6 AX101, 2230, 1x1 AX+BT, No vPro
Ficha técnica
63Em estoque
Mín.: 1
Mult.: 1

Wi-Fi 6 AX101 22 mm x 30 mm x 2.4 mm Bluetooth 802.11 ax
Fortebit Módulos multiprotocolo Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable.
Ficha técnica
5Em estoque
Mín.: 1
Mult.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS