LPAM Série Conectores placa placa e Mezzanine

Resultados: 74
Selecionar Imagem Número de peça Fabricante Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade. Qtde RoHS Modelo ECAD Produto Número de posições Afastamento Número de linhas Estilo de acabamento Ângulo de montagem Altura da Pilha Potência nominal Regime de tensão Taxa de dados máxima Temperatura operacional mínima Temperatura operacional máxima Galvanização do contato Material de contato Material da caixa Série Embalagem
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 178Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 272Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1,268Em estoque
Mín.: 1
Mult.: 1
Bobina: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 322Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 178Em estoque
Mín.: 1
Mult.: 1
Bobina: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 185Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 227Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 99Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 175Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 307Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 391Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 153Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 289Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 353Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 78Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 33Em estoque
300Esperado 02/03/2026
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 46Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 262Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 6Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 74Em estoque
Mín.: 1
Mult.: 1
Bobina: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 625
Mult.: 625
Bobina: 625

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 400
Mult.: 400
Bobina: 400

LPAM Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 400
Mult.: 400
Bobina: 400

LPAM Reel