Microchip Technology HV-D3 mSiC® Power Modules
Microchip Technology HV-D3 mSiC® Power Modules simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high-voltage power applications. These high-efficiency power modules integrate 3.3kV silicon carbide (SiC) mSiC MOSFETs and Schottky diodes in an industry-standard 62mm package. This design construction enables efficient power delivery from medium-voltage grids directly to server racks. The HV-D3 modules deliver low switching losses, strong thermal performance, and high power density for demanding applications. Typical applications for Microchip Technology HV-D3 mSiC Power Modules include power transmission and distribution, industrial power, data centers, marine and aerospace, Electric Vehicle (EV) infrastructure, and renewable energy systems.
Phase Leg
The phase-leg module topology integrates two power switches in a half-bridge configuration, with a high-side and low-side device connected to a shared output node. This topology is used as a building block for single-phase and three-phase inverters, motor drives, and power conversion stages requiring bidirectional current flow and efficient switching.
Dual Common Source
The dual common-source module topology integrates two power MOSFETs that share a common source connection, providing independent drain terminals. This configuration offers greater flexibility for certain converter architectures and simplifies current sensing and gate-drive referencing. The dual common-source module topology is used in applications such as DC-DC converters, multi-level topologies, and specialized inverter designs, where control and layout optimization are priorities.
Features
- High-efficiency power conversion:
- Exhibits low switching and conduction losses
- Improves overall system efficiency
- Reduces heat generation
- Enables higher switching frequencies
- High-voltage and -current capability:
- Supports high-voltage operation of up to 3.3kV
- Delivers robust current capability for reliable, high-power conversion
- Compact, integrated module form:
- Multiple switches and diodes in a single package with standardized terminals
- Simplified assembly
- More compact and reliable solution compared to discrete device implementations
- Superior thermal performance:
- Thermal design with silicon nitride (Si3N4) substrate, including low junction-to-case thermal resistance and high junction temperature
- Supports higher power density
- Less-aggressive cooling requirements
- Enhanced switching performance:
- SiC technology supports fast switching transitions with minimal reverse recovery effects
- Enables smaller, passive components
- Potentially lowers system weight and cost
- Robust high-voltage isolation:
- Reliable modules designed for high-voltage applications
- 6kV insulation, Comparative Tracking Index 600 (CTI 600) case, and robust Si3N4 substrate
- Offers high dielectric strength and creepage distances
- Design flexibility:
- Half-bridge and common source configurations
- Well-suited for 2-level and multi-level converters
- Improved system reliability:
- Better avalanche ruggedness, thermal stability, and tolerance to voltage stress
- Longer service life
- Fewer field failures
Applications
- Power transmission and distribution:
- Medium-voltage DC-DC converters
- SSTs
- High-voltage power supplies
- Industrial power:
- High-power Variable Frequency Drives (VFDs)
- Pumps, compressors, and large industrial machinery
- Data centers:
- SSTs
- Uninterruptible Power Supply (UPS) systems
- Medium-voltage power planes and direct distribution
- Centralized AC-DC conversion
- Marine and aerospace:
- Electric propulsion systems for ships and aircraft
- High-voltage auxiliary power units
- EV infrastructure:
- Fast DC charging stations
- High-voltage onboard chargers for commercial vehicles
- Renewable energy systems:
- Solar, central inverters, and string inverters
- Wind turbine converters
- Energy Storage Systems (ESS) and grid-tied inverters
Application Examples
