Amphenol TCS HD Express® Interconnect System
Amphenol TCS HD Express® Interconnect System is a high-performance, high-density backplane solution designed to meet PCIe Generation 6 mechanical and electrical requirements for 85Ω impedance systems. Engineered with a single-wafer design, this system enables easy system scaling and offers a competitive cost structure. All press-fit pins ensure reliable board terminations, making the Amphenol TCS HD Express Interconnect System ideal for servers, storage, and high-performing applications.
Features
- Supports PCIe Generation 6 links
- Press-fit technology
- High density
- Ground structure on all 4 sides of mating beams of each differential pair
- Beam on blade
- Diecast guide module
- Single-wafer design using traditional design elements
- High signal isolation performance
Applications
- Servers
- Storage
- Supercomputers
Specifications
- 85Ω impedance
- 13.8 mil drill-compliant pin
- Electrical performance
- <30VAC(RMS) rated voltage (UL agency)
- TBD dielectric withstanding voltage
- 10mΩ maximum contact resistance change
- Material
- Gold contact finish area
- Copper alloy contact base material
- Glass-reinforced polyester (LCP) housing
- UL 94V-0 rating
- -40°C to 105°C operating temperature range
Mechanical Drawings
Publicado: 2025-02-19
| Atualizado: 2025-10-07