200-LPAF Conectores placa placa e Mezzanine

Resultados: 118
Selecionar Imagem Número de peça Fabricante Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade. Qtde RoHS Modelo ECAD Produto Número de posições Afastamento Número de linhas Estilo de acabamento Ângulo de montagem Altura da Pilha Potência nominal Regime de tensão Taxa de dados máxima Temperatura operacional mínima Temperatura operacional máxima Galvanização do contato Material de contato Material da caixa Série Embalagem
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 316Em estoque
Mín.: 1
Mult.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 730Em estoque
Mín.: 1
Mult.: 1
: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 375Em estoque
Mín.: 1
Mult.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 390Em estoque
Mín.: 1
Mult.: 1
: 500

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460Em estoque
Mín.: 1
Mult.: 1
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 517Em estoque
Mín.: 1
Mult.: 1
: 550

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 153Em estoque
Mín.: 1
Mult.: 1
: 500

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 439Em estoque
Mín.: 1
Mult.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 35Em estoque
Mín.: 1
Mult.: 1
: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 75Em estoque
Mín.: 1
Mult.: 1
: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 431Em estoque
Mín.: 1
Mult.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine 1.27MM LP ARRAY HS HD ARRAY 288Em estoque
Mín.: 1
Mult.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 9Em estoque
325Esperado 07/09/2026
Mín.: 1
Mult.: 1
: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 459Em estoque
Mín.: 1
Mult.: 1
: 550

Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1,123Em estoque
Mín.: 1
Mult.: 1
: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 319Em estoque
Mín.: 1
Mult.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
385Esperado 18/08/2026
Mín.: 1
Mult.: 1
: 425

LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
319Esperado 17/08/2026
Mín.: 1
Mult.: 1
: 350

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 475
Mult.: 475
: 475

LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 3 semanas
Mín.: 500
Mult.: 500
: 500

LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 500
Mult.: 500
: 500
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 7 semanas
Mín.: 325
Mult.: 325
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 4 semanas
Mín.: 550
Mult.: 550
: 550
LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 6 semanas
Mín.: 550
Mult.: 550
: 550

LPAF Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo de conclusão sem o estoque 7 semanas
Mín.: 1
Mult.: 1
: 650

LPAF Reel, Cut Tape