i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.

Resultados: 15
Selecionar Imagem Número de peça Fabricante Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade. Qtde RoHS Modelo ECAD Tipo Núcleo Frequência operacional Temperatura operacional mínima Temperatura operacional máxima Embalagem
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 1,128Em estoque
Mín.: 1
Mult.: 1

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 414Em estoque
Mín.: 1
Mult.: 1

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 807Em estoque
Mín.: 1
Mult.: 1

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 1
Mult.: 1

ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors Systems on a Chip (sistemas em chip) RF - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Tempo de conclusão sem o estoque 16 semanas
Mín.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray