DIP300 SOIC Adapters

Chip Quik DIP300 Single Outline Integrated Circuits (SOIC) feature wide- and narrow-bodied adapters with a 10-28 dual in-line package (DIP) range. The SOICs offer an FR-4 UL 94V-0 PCB, a PA6T plastic body, and a gold-plated pin construction within its 1.27mm pitch. The Chip Quik DIP300 SOICs provide a ≤20mΩ contact resistance per contact and ≥500MΩ insulation resistance at 100V. The SOICs operate within a -40°C to +130°C temperature range and feature a 300VAC withstanding voltage per minute.

Resultados: 20
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Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade.
Qtde RoHS Modelo ECAD Produto
Número de posições
Número de linhas
Afastamento
Estilo de acabamento
Galvanização do contato
Temperatura operacional mínima
Temperatura operacional máxima
Chip Quik CI e soquetes de componentes DIP-16 (0.3" width, 0.1" pitch) to SOIC-16 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
23Em estoque
23Esperado 06/03/2026
Mín.: 1
Mult.: 1

DIP Sockets 16 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-10 (0.3" width, 0.1" pitch) to SOIC-10 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
24Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 10 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-12 (0.3" width, 0.1" pitch) to SOIC-12 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 12 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-12 (0.3" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 12 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-14 (0.3" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
22Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 14 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-18 (0.3" width, 0.1" pitch) to SOIC-18 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 18 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-18 (0.3" width, 0.1" pitch) to SOIC-18 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 18 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-22 (0.3" width, 0.1" pitch) to SOIC-22 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 22 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-22 (0.3" width, 0.1" pitch) to SOIC-22 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 22 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-24 (0.3" width, 0.1" pitch) to SOIC-24 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
24Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 24 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-24 (0.3" width, 0.1" pitch) to SOIC-24 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
19Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 24 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-26 (0.3" width, 0.1" pitch) to SOIC-26 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
23Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 26 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-26 (0.3" width, 0.1" pitch) to SOIC-26 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 26 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-28 (0.3" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
17Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 28 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-14 (0.3" width, 0.1" pitch) to SOIC-14 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
15Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 14 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-16 (0.3" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
8Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 16 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-10 (0.3" width, 0.1" pitch) to SOIC-10 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
14Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 10 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-20 (0.3" width, 0.1" pitch) to SOIC-20 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Ficha técnica
18Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 20 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-20 (0.3" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
7Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 20 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik CI e soquetes de componentes DIP-28 (0.3" width, 0.1" pitch) to SOIC-28 Wide (1.27mm pitch, 300 mil body) Adapter
Ficha técnica
12Em estoque
Mín.: 1
Mult.: 1

DIP Sockets 28 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C