Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Resultados: 6
Selecionar Imagem Número de peça Fabricante Descrição Ficha técnica Disponibilidade Preços (USD) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade. Qtde RoHS Modelo ECAD Produto Comprimento Largura Altura
Advanced Thermal Solutions Dissipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158Em estoque
Mín.: 1
Mult.: 1

Advanced Thermal Solutions Dissipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352Em estoque
Mín.: 1
Mult.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Dissipadores de calor maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93Em estoque
Mín.: 1
Mult.: 1

Advanced Thermal Solutions Dissipadores de calor maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104Em estoque
Mín.: 1
Mult.: 1

Advanced Thermal Solutions Dissipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86Em estoque
Mín.: 1
Mult.: 1

Advanced Thermal Solutions Dissipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29Em estoque
100Esperado 27/03/2026
Mín.: 1
Mult.: 1