XHP™ 2 1700V IGBT Modules

Infineon Technologies XHP™ 2 1700V IGBT Modules are high-performance power devices built on a scalable platform optimized for demanding high-power systems. The XHP 2 package features a low-inductive, multi-package housing that minimizes parasitic inductance and enables clean switching behavior. These characteristics help reduce voltage overshoot and switching losses in high-current applications. Combined with advanced TRENCHSTOP™ IGBT technologies and .XT interconnection, these modules deliver high current density, low saturation voltage, and robust thermal cycling capability, supporting reliable operation at elevated junction temperatures up to +175°C. High power density and a scalable mechanical design allow consistent integration across different converter platforms while maintaining efficiency and long service life.