Anaren Xinger® III Directional Couplers are low-profile, high-performance couplers in easy-to-use, surface-mount packages. These couplers provide power and frequency detection, as well as for VSWR monitoring, where tightly controlled coupling and low insertion loss is required. At 1/4 the size featuring footprints as small as 0.25" x 0.20", Xinger III Directional Couplers offer the same high directivity as previous Xinger generations - plus lower insertion loss (down to 0.05dB), increased power-handling ability, and superior CTE characteristics compared to ceramics. Anaren Xinger III Directional Couplers can be used in high-power applications up to 225 watts, and are ideal for AMPS, GSM, WCDMA, and LTE band applications.
3rd generation version of Xinger and Xinger-II SMT components = high-performance option
Offers the same high directivity as previous generations - plus 37-64% lower insertion loss (down to 0.05dB) and 50% higher power handling ability at 1/4 the size
Supports complete range of bands, including WCDMA, 3G, 4G, LTE, among many others
Very low loss
Superior CTE characteristics relative to ceramics - no solder cracking, no need for high-performance PCB
Anaren Xinger® III 90 Degree Hybrid Couplers
Lower insertion loss, higher isolation, & superior CTE properties for high-power BSE applications.