Laird Technologies

Laird Technologies designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market.

Produtos em destaque por Laird Technologies

Tflex™ SF16 Thermal Gap Fillers

Tflex™ SF16 Thermal Gap Fillers

Innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio.

MAF06 High-Current Low DCR SMD Power Inductors

MAF06 High-Current Low DCR SMD Power Inductors

Power line noise suppression and desired power efficiency while delivering extremely low DCR.

Tflex™ HR6.5 Thermal Gap Filler

Tflex™ HR6.5 Thermal Gap Filler

Thermal interface material with >6W/mK thermal conductivity with high recovery properties.

Tflex™ CR550 2-Part Dispensable Gap Filler

Tflex™ CR550 2-Part Dispensable Gap Filler

Transfers unwanted heat in automotive components and the A+B putty material cures in place.